Nintendo Wii Points Generator 2014 (209.36 KB)
Nintendo Wii Points Generator 2014
Source title: Direct evidence of electromigration failure mechanism in dual-damascene Cu interconnect tree structures - Direct, evidence, of, electromigration, failure, mechanism, in, dual-damascene, Cu, interconnect, tree, structures, Abstract
, In, situ, secondary, electron, microscope, (SEM), characterizations, were, carried, out, to, study, electromigration, failure, mechanism, in, dual-damascene, Cu, interconnect, tree, structures, which, are, important, for, reliability, assessment, as, well, as, design, optimizations, of, on-chip, interconnects., Direct, evidence, of, electromigration-induced, degradation, in, interconnect, tree, structure, consisting, of, void, nucleation, and, void, movement, in, opposite, direction, to, electron, flow, along, the, Cu/SiNx, interface, was, unraveled., The, peculiar, electromigration, behavior, of, Cu, interconnect, tree, structures, can, be, clearly, understood, based, on, this, mechanism., Dependence, of, electromigration, mechanism, of, a, segment, in, a, Cu, interconnect, tree, on, current, configuration, in, neighboring, interconnect, segment, is, discussed, in, detail. - sciencestage.com Engineering
http://sciencestage.com/d/5637797/direct-evidence-of-electromigration-failure-mechanism-in-dual-damascene-cu-interconnect-tree-structu.html |
